Description
99.3% tin and 0.7% copper M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Cu (Tin/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder. Features / Benefits Lead free Complies with RoHS Exceeds the impurity requirements of J-Std-006 No Clean flux 21 Gauge, 0.032″ diameters Excellent wettability Hard non-conductive residues 1LB (454G) spool
