Description
Heat transfer compound, – Silicone, High thermal conductivity, High dielectric constant, High dissipation factor, Use with heat sinks or metal chassis, Will not dry or harden, Contains zincs oxides and polydimenthyl siloxane, Non-silicone version available. Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast’s and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. Single Packets, 4g/0.1oz
