Description

Sn96 Lead Free Solder, 96.5% tin, 0.5% copper and 3% silver, 17 g (0.6 oz), 21 Gauge, 0.032″ diameters

M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder.

If your products might enter Europe or California, you must ensure they are RoHS compliant. Products containing lead will not comply.

Features / Benefits

Lead free

Complies with RoHS

Exceeds the impurity requirements of J-Std-006

No Clean flux

21 Gauge, 0.032″ diameters

Excellent wettability

Hard non-conductive residues

1 lb of lead free solder has 27% more length than leaded solder

Flux Percentage  M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0%.

Flux Core  A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0.Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications.